BGA Secondary Reflow & Ball Separation

BGA Secondary Reflow & Ball Separation

Bob Willis

4 года назад

12,006 Просмотров

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@jessstuart7495
@jessstuart7495 - 04.11.2021 06:34

Is this due to the pcb or component substrate flexing while heating?

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@kusobatto
@kusobatto - 01.04.2021 12:37

Hello!
Thank you very much for providing this video.
May I ask you the facility you used to take this video?

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@gianni8209
@gianni8209 - 11.03.2021 06:22

This is such a cool shot of the reflow process. Thanks Bob

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@parcalabehcet
@parcalabehcet - 01.04.2020 19:57

What exactly is this? Trying to reflow a chip without removing and reballing it?

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